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Sputtering Target
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Huita Optoelectronic Material Co.,Ltd
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Sputtering Target
Showing 1 - 2 of 2, total 1 pages [First] [Previous] [Next] [Last]
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silicon(si) sputtering target
Specification: 5N, 6N
Detail: Silicon aluminum rotating target Silica-aluminum ratio: 90:10 (wt%) or pure silicon, other ratios can be ***ermined as required. Purity: 4N Relative density: 2.1g/m3 Forming process: thermal spraying Specification: length...
2
molybdenum(mo) sputtering target
Specification: 3N5
Detail: Element Symbol: Mo Purity: 3N5 Availble Shape: Planar target, Rotary target Specifications: customized according to customer requirements Production process: Molybdenum billet (raw material)- inspection - hot rolling - ...
Showing 1 - 2 of 2, total 1 pages [First] [Previous] [Next] [Last]
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